METHOD OF MANUFACTURING RECYCLED SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a recycled substrate that can efficiently remove a semiconductor layer laminated on a substrate in a laminated semiconductor wafer, and by which the substrate is less damaged in semiconductor layer removal processing, and that is small in a wastage amount of the substrate.SOLUTION: Provided is a recycled substrate manufacturing method for recycling a substrate by removing a semiconductor layer from a laminated semiconductor wafer configured by laminating the semiconductor layer on the substrate. The method includes a step of supplying to a polishing pad a polishing material having a hardness equal to or more than a hardness of the semiconductor layer and equal to or less than a hardness of the substrate, and making a polished surface of the laminated semiconductor wafer and the polishing pad contact with each other to polish and remove the semiconductor layer from the lamination semiconductor wafer. 【課題】積層半導体ウェハにおける基板上に積層された半導体層を効率的に除去でき、かつ、半導体層除去処理において基板へのダメージが少なく、かつ、基板の減肉量が少ない再生基板の製造方法を提供する。【解決手段】基板上に半導体層が積層されてなる積層半導体ウェハから、前記半導体層を除去して前記基板を再生する、再生基板の製造方法であって、前記半導体層の硬度以上、かつ、前記基板の硬度以下の硬度を有する研磨材を研磨パッドに供給し、前記積層半導体ウェハの被研磨面と前記研磨パッドとを接触させて、前記積層半導体ウェハから前記半導体層を研磨除去する工程を有する再生基板の製造方法。【選択図】図２