HEAT-RESISTANT PASTING SHEET

PROBLEM TO BE SOLVED: To provide a heat-resistant pasting sheet which can be peeled without a paste residue to an adherend when the pasting sheet is peeled from the adherend even after exposed to a high-temperature environment.SOLUTION: There is provided a pasting sheet obtained by laminating an ant...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: IRIE HIROAKI, SUZUKI KYOICHI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a heat-resistant pasting sheet which can be peeled without a paste residue to an adherend when the pasting sheet is peeled from the adherend even after exposed to a high-temperature environment.SOLUTION: There is provided a pasting sheet obtained by laminating an antistatic easily adhesive layer and an absorption layer in this order on one surface (A surface) of a polyimide film, wherein the antistatic easily adhesive layer contains a polythiophene-based conductive polymer and a dopant, or contains a polythiophene-based conductive polymer, a dopant and a crosslinking agent. 【課題】高温環境にさらされた後でも、被着体から貼着用シートを剥がした際に、被着体への糊残りが無く剥がせる耐熱性貼着用シートを提供することである。【解決手段】ポリイミドフィルムの片面(A面)に帯電防止性易接着層、吸着層をこの順に積層した貼着用シートであって、前記帯電防止性易接着層が、ポリチオフェン系導電性ポリマーとドーパントを含有する貼着用シート。また、前記帯電防止性易接着層が、ポリチオフェン系導電性ポリマーとドーパントと架橋剤を含有する貼着用シート。【選択図】 なし