HEAT-RESISTANT PASTING SHEET
PROBLEM TO BE SOLVED: To provide a heat-resistant pasting sheet which can be peeled without a paste residue to an adherend when the pasting sheet is peeled from the adherend even after exposed to a high-temperature environment.SOLUTION: There is provided a pasting sheet obtained by laminating an ant...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a heat-resistant pasting sheet which can be peeled without a paste residue to an adherend when the pasting sheet is peeled from the adherend even after exposed to a high-temperature environment.SOLUTION: There is provided a pasting sheet obtained by laminating an antistatic easily adhesive layer and an absorption layer in this order on one surface (A surface) of a polyimide film, wherein the antistatic easily adhesive layer contains a polythiophene-based conductive polymer and a dopant, or contains a polythiophene-based conductive polymer, a dopant and a crosslinking agent.
【課題】高温環境にさらされた後でも、被着体から貼着用シートを剥がした際に、被着体への糊残りが無く剥がせる耐熱性貼着用シートを提供することである。【解決手段】ポリイミドフィルムの片面(A面)に帯電防止性易接着層、吸着層をこの順に積層した貼着用シートであって、前記帯電防止性易接着層が、ポリチオフェン系導電性ポリマーとドーパントを含有する貼着用シート。また、前記帯電防止性易接着層が、ポリチオフェン系導電性ポリマーとドーパントと架橋剤を含有する貼着用シート。【選択図】 なし |
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