Pb-FREE Zn-BASED SOLDER PASTE

PROBLEM TO BE SOLVED: To provide a solder paste that is excellent in wet ability and has stress relaxation property capable of standing actual use, and can stand reflow temperature which is about 300°C sufficiently.SOLUTION: Provided is the solder paste containing a Zn-based solder alloy and a flux....

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	IZEKI TAKASHI, TAKAMORI MASAHITO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a solder paste that is excellent in wet ability and has stress relaxation property capable of standing actual use, and can stand reflow temperature which is about 300°C sufficiently.SOLUTION: Provided is the solder paste containing a Zn-based solder alloy and a flux. The Zn-based solder alloy comprises 1.0 mass%-9.0 mass% of Al, at least one of Mg and Ge, when containing Mg, 0.1 mass%-4.0 mass%, when containing Ge, 0.05 mass%-6.0 mass%, and balance is formed of Zn except for chemical elements inevitably contained in production, in which a total amount of the Zn-base solder alloy is 100 mass%. 【課題】濡れ性に特に優れ、実用に耐えうる応力緩和性を有し、３００℃程度のリフロー温度に十分耐えることができるはんだペーストを提供する。【解決手段】Ｚｎ系はんだ合金とフラックスとを含むＺｎ系はんだペーストであって、前記Ｚｎ系はんだ合金は、その全量を１００質量％として、Ａｌを１.０質量％以上９.０質量％以下含有し、Ｍｇ及びＧｅのうちの少なくとも一方を含有し、Ｍｇを含有する場合は０.１質量％以上４.０質量％以下、Ｇｅを含有する場合は０.０５質量％以上６.０質量％以下含有し、残部が製造上、不可避に含まれる元素を除きＺｎからなる。【選択図】なし