MULTILAYER SUBSTRATE AND ELECTRONIC EQUIPMENT USING THE SAME, METHOD FOR MANUFACTURING ELECTRONIC EQUIPMENT
PROBLEM TO BE SOLVED: To prevent cracks from being generated in a protective film.SOLUTION: The surface roughness of a side surface 63b of an outer edge pattern 63 is made lower than that of a part of inner edge patterns 61, 62 covered with a protective film 110. When electronic equipment having a m...
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To prevent cracks from being generated in a protective film.SOLUTION: The surface roughness of a side surface 63b of an outer edge pattern 63 is made lower than that of a part of inner edge patterns 61, 62 covered with a protective film 110. When electronic equipment having a mold resin 150 is manufactured by press-welding a mold 200 to a surface 10a side of a multilayer substrate 10 after mounting electronic parts 121 to 123 on a land 61, the protective film 110 covering the outer edge pattern 63 is press-welded to the mold 200. The protective film 110 is easily peeled from the side surface of the outer edge pattern 63 because the surface roughness of the side surface 63b of the outer edge pattern 63 is low. Therefore when the protective film 110 is peeled from the side surface 63b of the outer pattern 63, stress generated in the protective film 110 can be released, and it is possible to suppress generations of cracks in the protective film 110.
【課題】保護膜にクラックが発生することを抑制する。【解決手段】外縁パターン６３の側面６３ｂを内縁パターン６１、６２のうち保護膜１１０で覆われる部分の表面粗さよりも小さくする。これによれば、ランド６１に電子部品１２１〜１２３を搭載した後、金型２００を多層基板１０の一面１０ａ側に圧接してモールド樹脂１５０を備える電子装置を製造する場合、外縁パターン６３を覆う保護膜１１０が金型２００に圧接される。このとき、外縁パターン６３は側面６３ｂの表面粗さが小さくされているため、保護膜１１０が外縁パターン６３の側面から剥離し易くなる。したがって、保護膜１１０が外縁パターン６３の側面６３ｂから剥離した場合には保護膜１１０に発生する応力を開放でき、保護膜１１０にクラックが発生することを抑制できる。【選択図】図２ |
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