RADIATION-SENSITIVE RESIN COMPOSITION, CURED FILM, AND PATTERN FORMING METHOD

PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which sufficiently satisfies general characteristics such as sensitivity and can reduce pattern shape defects due to post exposure delay and adhesive failures.SOLUTION: There is provided a radiation-sensitive resin composition...

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Bibliographische Detailangaben
Hauptverfasser: SETO RYOTA, ENDO TAKESHI, MATSUMOTO KOZO, ICHINOHE DAIGO, YAMAZAKI RYU
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which sufficiently satisfies general characteristics such as sensitivity and can reduce pattern shape defects due to post exposure delay and adhesive failures.SOLUTION: There is provided a radiation-sensitive resin composition which comprises: [A] a polymerizable component which contains a structural unit (I) containing an acid dissociation group and a structural unit (II) containing a group represented by the following formula (1); and [B] a photoacid generator. (wherein, X represents an oxygen atom or a sulfur atom; Rrepresents a hydrocarbon group having 1 to 20 carbon atoms, a heterocyclic group having 2 to 12 carbon atoms, and an organic group containing a (meth)acryloyl group; and * represents a bonding position.) 【課題】感度等の一般的特性を十分満足し、かつ露光後の引き置きによるパターン形状不良、密着性不良の低減を可能とする感放射線性樹脂組成物を提供することを目的とする。【解決手段】上記課題を解決するためになされた発明は、[A]同一又は異なる重合体中に、酸解離性基を含む構成単位(I)と下記式(1)で示される基を含む構造単位(II)を含む重合成分、並びに[B]光酸発生剤を含有する感放射線性樹脂組成物によって達成される。(式(1)において、Xは酸素原子または硫黄原子を示し、R1は、炭素数1から20の炭化水素基、炭素数2から12の複素環基、(メタ)アクリロイル基を含む有機基を示す。*は結合する位置を示す。)【選択図】なし