METHOD AND DEVICE FOR ASSEMBLING ELECTRONIC COMPONENT OR OPTICAL COMPONENT ON SUBSTRATE

PROBLEM TO BE SOLVED: To provide a manufacturing method and a manufacturing device for recognizing or eliminating the problem in which the axial error of a suction member and deformation of a pick and place system and a substrate base occur during the accumulation of joining forces without the need...

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Bibliographische Detailangaben
Hauptverfasser: HANNES KOSTNER, MAYR ANDREAS, HUGO PRISTAUZ, HARALD MEIXNER
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a manufacturing method and a manufacturing device for recognizing or eliminating the problem in which the axial error of a suction member and deformation of a pick and place system and a substrate base occur during the accumulation of joining forces without the need to configure the pick and place system particularly robust.SOLUTION: A method of the present invention includes receiving a component with a suction member 3, displacing a joining head 2 with respect to a substrate 6 with a first movement shaft and a second movement shaft, bringing the suction member 3 down until the component comes into contact with the substrate 6 with a third movement shaft, generating predetermined joining forces, pressing the component against the substrate 6 with the suction member 3, displacing the joining head 2 and/or substrate 6 by a correction value W1 with the first movement shaft and/or by a correction value W2 with the second movement shaft in order to correct an inclination position of the suction member 3 having occurred during the accumulation of the joining forces, measuring and recording the inclination position of the suction member 3, measuring sheer force at the inclination position of the suction member 3, and recording and/or compensating the sheer force. 【課題】吸着部材の軸誤差、並びにピック・アンド・プレース・システムや基板ベースの変形が、接合力が蓄積される間に生じる問題を、ピック・アンド・プレース・システムを特別強固に構成する必要なく認識する又はなくす製造方法および製造装置を提供する。【解決手段】吸着部材3により構成要素を受け取り、接合頭部2を基板6に対して第1の移動軸及び第2の移動軸により変位させ、構成要素が基板6に接触するまで吸着部材3を第3の移動軸により下げ、所定接合力を生成し、吸着部材3が構成要素を基板6に押し付ける。接合力が蓄積される間に生じた吸着部材3の傾斜位置を補正するために、第1の移動軸により補正値W1だけ、及び/又は第2の移動軸により補正値W2だけ接合頭部2及び/又は基板6を変位させ、吸着部材3の傾斜位置を測定し、記録する。吸着部材3の傾斜位置によるせん断力を測定し、せん断力を記録及び/又は補償する。【選択図】図6