SOLDERING METHOD

PROBLEM TO BE SOLVED: To provide a soldering method with which a void ratio in the solder after soldering is reduced.SOLUTION: The soldering method include: a first step of applying a solder paste 40 to one surface 21 of a lead frame 20; a second step of installing an element 30 on a side opposite t...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YAMAMOTO MASAYASU, SAKAMOTO ZENJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a soldering method with which a void ratio in the solder after soldering is reduced.SOLUTION: The soldering method include: a first step of applying a solder paste 40 to one surface 21 of a lead frame 20; a second step of installing an element 30 on a side opposite to the lead frame 20 of the solder paste 40; and a third step of providing vibration with a predetermined frequency or higher to the element 30 while irradiating a surface 22 on the opposite side of the solder paste 40 of the lead frame 20 with a laser beam 100. 【課題】はんだ付け後のはんだ内のボイド率が小さくなるはんだ付方法を提供する。【解決手段】第１工程では、リードフレーム２０の一方の面２１にはんだペースト４０を塗布する。第２工程では、はんだペースト４０のリードフレーム２０とは反対側に素子３０を設置する。第３工程では、リードフレーム２０のはんだペースト４０とは反対側の面２２にレーザ光１００を照射しつつ、素子３０に所定の周波数以上の振動を与える。【選択図】図６