DRAWING METHOD, DRAWING APPARATUS, AND EXPOSURE APPARATUS

PROBLEM TO BE SOLVED: To provide a direct exposure apparatus which can correct deformation of printed circuit boards, e.g. warp and expansion/contraction, with high accuracy and allows efficient correction processing.SOLUTION: A direct exposure apparatus includes a raster conversion processing portion 106 which converts a design wiring pattern 101 in the form of vector data into a first exposure pattern in the form of raster data, a memory control portion 113 which separates the first exposure pattern into a plurality of first lines of a height of 1 dot in the Y direction, a correction factor creation portion 104 which creates correction factors from differences between design values of positions of alignment marks provided on printed circuit boards and measurements, a line correction portion 114 which executes correction of the first lines by using both-end coordinates A and B of the first lines, a line division processing portion 117 which divides the first lines after the correction into a plurality of lines of a height of 1 dot in parallel with the Y direction to create second lines and a memory control portion 113 which creates an exposure pattern 6 in the full correction region by combining the second lines. 【課題】プリント基板のたわみ、伸縮等の変形を高精度に補正可能であり、かつ効率良く補正処理ができる直接露光装置を提供する。【解決手段】ベクタデータである設計配線パターン１０１をラスタデータである第１の露光パターンに変換するラスタ変換処理部１０６と、第１の露光パターンをＹ方向の高さ１ｄｏｔの複数の第１のラインに分離するメモリ制御部１１３と、プリント基板６に設けられたアライメントマーク位置の設計値と測定値との差分から補正係数を生成する補正係数生成部１０４と、第１のラインの両端座標Ａ，Ｂに補正係数を用いて第１のライン補正するライン補正部１１４と、補正後の前記第１のラインをＹ方向に平行な高さ１ｄｏｔの複数のラインに分割して第２のラインを生成するライン分割処理部１１７と、第２のラインの結合により全補正領域の露光パターン６を生成するメモリ制御部１１３と、を備えた。【選択図】図１