ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To improve the assembly workability while securing protection performance without using a member for filling a clearance.SOLUTION: In a cover 10, a thickness is reduced so that a plate thickness is reduced toward an opening 10a. A connector 3 is disposed in a housing 1 so that...

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1. Verfasser: KOYAMA YONOSUKE
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To improve the assembly workability while securing protection performance without using a member for filling a clearance.SOLUTION: In a cover 10, a thickness is reduced so that a plate thickness is reduced toward an opening 10a. A connector 3 is disposed in a housing 1 so that a clearance between an opening end 10b of the opening 10a and the connector 3 is smaller than a predetermined reference size. 【課題】隙間を埋めるための部材を用いることなく保護性能を確保しつつ、組み付け作業の作業性の向上を図る。【解決手段】カバー10は、開口部10aに近づくにつれて板厚が薄くなるように薄肉化されており、開口部10aの開口端10bとコネクタ3との間の隙間が予め定められた基準寸法未満となるように筐体1内にコネクタ3が配置されている。【選択図】図3