METAL ION SUPPLY DEVICE
PROBLEM TO BE SOLVED: To provide a metal ion supply device in which such a problem that melting of metal particles is blocked due to reduction in pressure inside a tank does not occur, and flow of metal particles in the tank is suppressed and also a space between metal particles can be made as narro...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a metal ion supply device in which such a problem that melting of metal particles is blocked due to reduction in pressure inside a tank does not occur, and flow of metal particles in the tank is suppressed and also a space between metal particles can be made as narrow as possible.SOLUTION: There is provided a metal ion supply device 10 which generates metal ion by causing plating solution to flow in a metal particle group g thereby melting metal particles m and supplies the generated metal ion to plating solution. The metal ion supply device 10 includes: a tank 1 having a porous plate 2 at the bottom end thereof for causing the plating solution to flow to the tank; a pressurization plate 4 which is disposed in the tank 1, pressurizes the housed metal particle group g downward, and is equipped with first magnets 5; and second magnets 6 which are freely movable up/down in height directions of the tank 1 on an outer periphery of the tank 1. In accordance with upward/downward movement of the second magnets 6, the first magnets 5 magnetically attracted to the second magnets 6 synchronizes with the second magnets 6 to move up/down the pressurization plate 4.
【課題】槽内の圧力が低下して金属粒の溶解が阻害されるといった問題が生じることなく、槽内における金属粒の流動が抑制され、かつ金属粒間の空間を可及的に狭くすることを可能とした金属イオン供給装置を提供すること。【解決手段】金属粒群g内にめっき液を流通させて金属粒mを溶解させ、生成された金属イオンをめっき液に供給する金属イオン供給装置10であり、その下端にめっき液を槽内に流通させる多孔板2を有している槽1と、槽1内に配設され、収容された金属粒群gを下方に加圧するとともに第1のマグネット5を備えた加圧板4と、槽1の外周において槽1の高さ方向に昇降自在な第2のマグネット6を備え、第2のマグネット6の昇降に応じて第2のマグネット6に磁気吸引された第1のマグネット5が同期して加圧板4を昇降させるようになっている。【選択図】図3 |
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