COOLING UNIT OF WORKPIECE

PROBLEM TO BE SOLVED: To provide a cooling unit of a workpiece which eliminates the need of a lifting mechanism etc., has a simple structure, shortens the cooling time of the workpiece, and achieves good cooling efficiency.SOLUTION: A reception device 1 of a semiconductor wafer includes: a pair of p...

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Bibliographische Detailangaben
Hauptverfasser: SHIGETA TAKASHI, TAKAOKA SHUNJI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a cooling unit of a workpiece which eliminates the need of a lifting mechanism etc., has a simple structure, shortens the cooling time of the workpiece, and achieves good cooling efficiency.SOLUTION: A reception device 1 of a semiconductor wafer includes: a pair of placement bases 10, 10 which support the semiconductor wafer W cooperatively. The pair of placement bases 10, 10 supports the semiconductor wafer W thereby forming a lower part open space 180a between an area between the pair of placement bases 10, 10 and a lower surface W1 of the semiconductor wafer W and forming an upper part open space 180b above the semiconductor wafer W. The reception device 1 of the semiconductor wafer further includes: a first jet nozzle 116 which jets a cooling gas from the lower side of the lower part open space 180a toward the lower surface W1 of the semiconductor wafer W; and a second jet nozzle 113 which jets the cooling gas from the upper side of the upper part open space 180b toward an upper surface W2 of the semiconductor wafer W. 【課題】昇降機構等が不要で、構成が簡単かつ被処理体の冷却時間を短縮でき、さらに冷却効率の良好な被処理体の冷却ユニットを提供する。【解決手段】半導体ウェーハの受容装置1は、半導体ウェーハWを協同して支持する一対の載置台10,10を備え、一対の載置台10,10により半導体ウェーハWを支持することで、載置台10,10間と半導体ウェーハWの下面W1との間に下部開放空間180aを形成するとともに、半導体ウェーハWの上方に上部開放空間180bを形成し、下部開放空間180aの下方より半導体ウェーハWの下面W1に向けて冷却用の気体を噴射する第1の噴射ノズル116と、上部開放空間180bの上方より半導体ウェーハWの上面W2に向けて冷却用の気体を噴射する第2の噴射ノズル113と、をさらに備えるように構成される。【選択図】図2