MANUFACTURING METHOD OF SUBSTRATE FOR SOLAR CELL, AND SOLAR CELL

PROBLEM TO BE SOLVED: To obtain a texture structure with which the cost of liquid chemical use can be reduced, which is uniform in a substrate surface and with which characteristics of a solar cell are prevented from being reduced.SOLUTION: A manufacturing method of a substrate for a solar cell includes: cutting out a semiconductor substrate by slicing a semiconductor ingot while using a processing slurry; and forming a texture on a surface of the substrate by applying surface processing to the substrate after removing a slurry on a surface of a wafer. In the surface processing of the semiconductor substrate such as a p-type single crystal silicon substrate, the semiconductor substrate is immersed in a first aqueous solution containing at least hydrogen peroxide and a metal scavenger, for removing an organic impurity and a metal impurity on the substrate surface (S1003), then a damage layer on the substrate surface caused by slicing the semiconductor ingot to obtain the semiconductor substrate is removed in a second aqueous solution containing at least an alkali substance (S1004), then it is immersed in a third aqueous solution such as an alkali-based aqueous solution, for performing anisotropic etching (S1005), thereby a texture structure formed of ruggedness is formed. 【課題】薬液使用コストを低減でき、かつ基板面内均一で太陽電池特性低下を引き起こさないテクスチャー構造を得ること。【解決手段】加工用スラリーを用いて半導体インゴットをスライスして半導体基板を切り出し、ウエハ表面のスラリーを除去した後、該基板を表面処理することにより、基板表面にテクスチャーを形成する太陽電池用基板の製造方法であって、ｐ型単結晶シリコン基板などの半導体基板の表面処理を、少なくとも過酸化水素と金属捕捉剤を含む第１の水溶液に浸漬して基板表面の有機不純物と金属不純物を除去した（Ｓ１００３）後、少なくともアルカリ物質を含む第２の水溶液で、前記半導体基板のスライスにより生じた基板表面のダメージ層を除去した（Ｓ１００４）後、アルカリ系水溶液などの第３の水溶液に浸漬して、異方性エッチングを行い（Ｓ１００５）、凹凸部からなるテクスチャー構造を形成する。【選択図】図１