ADHESIVE COMPOSITION, ADHESIVE FOR CIRCUIT CONNECTION, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER

PROBLEM TO BE SOLVED: To provide: an adhesive composition capable of achieving sufficiently high adhesive strength with respect to an adherend having on the surface thereof metal, such as copper; an adhesive for circuit connection using the adhesive composition; and a connection structure for a circ...

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Bibliographische Detailangaben
Hauptverfasser:	ARIFUKU MASAHIRO, IZAWA HIROYUKI, OKOSHI SHOJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CONDUCTORS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide: an adhesive composition capable of achieving sufficiently high adhesive strength with respect to an adherend having on the surface thereof metal, such as copper; an adhesive for circuit connection using the adhesive composition; and a connection structure for a circuit member.SOLUTION: An adhesive composition contains resin having a sulfide group. 【課題】銅等の金属を表面に有する被着体に対して十分に高い接着強度を達成することを可能にする接着剤組成物並びに該接着剤組成物を用いる回路接続用接着剤及び回路部材の接続構造体を提供すること。【解決手段】スルフィド基を有する樹脂を含有する接着剤組成物。【選択図】図１