PLATE MAKING APPARATUS
PROBLEM TO BE SOLVED: To provide a plate making apparatus and a stencil printer which can punch stencil paper consistently with good quality, independent of quality of the stencil paper, without deterioration of the life of the apparatus.SOLUTION: A plate making writing portion 20 includes a thermal...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a plate making apparatus and a stencil printer which can punch stencil paper consistently with good quality, independent of quality of the stencil paper, without deterioration of the life of the apparatus.SOLUTION: A plate making writing portion 20 includes a thermal head 21 arranged with heat generation elements, a platen roller 24 capable of nipping a stencil paper sheet 23 between the thermal head 21 and it, a plate-making pressure application mechanism 508 which imparts a plate-making pressure to the stencil paper sheet 23 by causing the thermal head 21 and the platen roller 24 to nip the stencil paper sheet 23 and apply a plate-making pressure to the stencil paper sheet 23 and a plate-making pressure variable mechanism 510 making variable the plate-making pressure by the plate-making pressure application mechanism 508.
【課題】孔版原紙の品質にかかわらずに孔版原紙に同等の良好な品質で穿孔を施すことを、装置寿命を短くすることなく行うことができる製版装置および孔版印刷装置を提供することを課題とする。【解決手段】製版書込部20は、発熱素子が配列されているサーマルヘッド21と、サーマルヘッド21との間で孔版原紙23をニップ可能なプラテンローラ24と、サーマルヘッド21とプラテンローラ24とをニップさせ、孔版原紙23に製版圧をかけて孔版原紙23に製版圧を付与する製版圧付与機構508と、製版圧付与機構508による製版圧を可変にする製版圧可変機構508とを備えている。【選択図】図4 |
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