HIGH-FREQUENCY PACKAGE

PROBLEM TO BE SOLVED: To solve the problem that the size of an outermost periphery of a package becomes larger and whereby the package size becomes larger by increasing BGA ball arrays for preventing an unwanted emission signal.SOLUTION: A high-frequency package includes a second dielectric multilayer substrate facing a rear surface of a first dielectric multilayer substrate on which a high-frequency circuit is mounted and bonded to the first dielectric multilayer substrate by a plurality of conductive connection members. The second dielectric multilayer substrate has a first dielectric opening formed on an opposite surface of the first dielectric multilayer substrate and in which a ground conductor is removed; a dielectric waveguide having one end connected to the first dielectric opening; a second dielectric opening connected to the other end of the dielectric waveguide; and an end short-circuit waveguide having one end connected to the second dielectric opening and the other end short-circuited to a plurality of via arrays. The conductive connection members have conductive connection members for unwanted emission prevention arranged in at least one array on the outside along the outer periphery of the first dielectric multilayer substrate.