METAL FILM FORMATION METHOD AND CONDUCTIVE INK USED FOR METHOD

PROBLEM TO BE SOLVED: To provide a metal film formation method onto a surface capable of forming a metal film easily by a simple method, onto the surface having a contact with a hole, of a substrate having the hole.SOLUTION: A metal film formation method has a step for heating a substrate in the sta...

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Bibliographische Detailangaben
Hauptverfasser:	OKITA KENZO, ARITOME ISAO, TANAKA TAKERO, SHIMODA SUGIO, WATABE KAZUTO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a metal film formation method onto a surface capable of forming a metal film easily by a simple method, onto the surface having a contact with a hole, of a substrate having the hole.SOLUTION: A metal film formation method has a step for heating a substrate in the state where a conductive ink containing a metal salt and a reducer is allowed to have a contact with a surface having a contact with a hole, of a substrate having the hole.