X-RAY INSPECTION SYSTEM AND X-RAY INSPECTION METHOD

PROBLEM TO BE SOLVED: To provide an X-ray inspection system and an X-ray inspection method capable of inspecting a soldered portion on the front side of a substrate with improved accuracy.SOLUTION: An X-ray inspection system comprises an X-ray inspection device 2 and an information processing device...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: NAKAHARA TATSUFUSA
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an X-ray inspection system and an X-ray inspection method capable of inspecting a soldered portion on the front side of a substrate with improved accuracy.SOLUTION: An X-ray inspection system comprises an X-ray inspection device 2 and an information processing device. The information processing device obtains solder information relating to solder applied to the back surface of a substrate 3 on the basis of a result of appearance inspection of the back surface of the substrate 3 or a result of X-ray inspection of the back surface of the substrate 3, calculates a position and a gray value thereof where the solder applied to the back surface of the substrate 3 appears in a result of X-ray inspection of the front surface of the substrate 3 on the basis of at least one of the solder information and design information on the solder applied to the back surface of the substrate 3, information on the thickness of the substrate 3 and information on positional relation between X-ray tubes 21 and detectors 22 of the X-ray inspection device 2, and eliminates effect of the solder on the back surface of the substrate 3 appearing in the result of X-ray inspection of the front surface of the substrate 3 on the basis of the position and the gray value.