CHAMBER SYSTEM

PROBLEM TO BE SOLVED: To improve throughput upon processing work in a state of reduced pressure.SOLUTION: A chamber system comprises: a table 10 comprising a plurality of chambers 11 to 16 into which work is serially stored; a plate 20 on which a plurality of opening parts 21 to 26 corresponding to...

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Bibliographische Detailangaben
1. Verfasser:	IDO TAKANORI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve throughput upon processing work in a state of reduced pressure.SOLUTION: A chamber system comprises: a table 10 comprising a plurality of chambers 11 to 16 into which work is serially stored; a plate 20 on which a plurality of opening parts 21 to 26 corresponding to each of the chambers 11 to 16 are formed, and moving relatively to the table 10 so that each of the chambers 11 to 16 serially faces to each of the adjacent opening parts 21 to 26; pressure reducing valves 30, 40 attached to the opening parts 22, 23 positioned downstream of the opening part for storing work; a pressure reducing pump connected to the pressure reducing valves 30, 40; a pressure reduction processing room 60 attached to the opening part 25 positioned downstream of the opening parts 22, 23 to which the pressure reducing valves 30, 40 are attached; and a sealing fluid 80 positioned between surface of the table 10 on which the chambers are formed and the plate 20.