ALUMINUM FOIL WITH METAL LAYER AND PRODUCTION METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a metal layer with an optimum thickness having sufficient adhesion force on the surface of an aluminum foil by a vacuum film deposition method without using a chemical treatment or a plating treatment causing cost increase, deterioration of an environment or lowering...

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Bibliographische Detailangaben
Hauptverfasser:	UEDA YUKINORI, KAWAGUCHI HIROYUKI, IIJIMA TOSHIKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a metal layer with an optimum thickness having sufficient adhesion force on the surface of an aluminum foil by a vacuum film deposition method without using a chemical treatment or a plating treatment causing cost increase, deterioration of an environment or lowering of productivity.SOLUTION: In an aluminum foil with a metal layer, the metal layer is formed by a vacuum film deposition method by using an aluminum foil whose water contact angle of the surface is 85° or less. In the aluminum foil with the metal layer, adhesion between the metal layer and the aluminum foil is heightened by providing a first metal layer and a second metal layer.