FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a flexible circuit board which is arranged to keep high insulation reliability, to achieve highly tight adhesion of a wiring line, and to have low thermal expandability, and allows a fine circuit to be formed.SOLUTION: A flexible circuit board has a copper circuit fo...

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Bibliographische Detailangaben
Hauptverfasser:	AIDA HIDEKI, NISHIMURA KOJI, HAMAZAWA AKIHISA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a flexible circuit board which is arranged to keep high insulation reliability, to achieve highly tight adhesion of a wiring line, and to have low thermal expandability, and allows a fine circuit to be formed.SOLUTION: A flexible circuit board has a copper circuit formed to have a pattern having a width of 4-18 μm by performing a wiring pattern process, by an electric copper plating method, on a nickel plating layer of a polyimide film with the nickel plating layer which is arranged by stacking at least a nickel plating layer on the polyimide film. The polyimide film has a thermal expansion coefficient of 0-8 ppm/°C in a range of 100-200°C, and the nickel plating layer has a thickness of 0.03-0.3 μm.