DIE BONDER, BOND HEAD DEVICE THEREOF, AND COLLET POSITION ADJUSTING METHOD

PROBLEM TO BE SOLVED: To provide a die bonder capable of automatically correcting (adjusting) errors including height and inclination in changing a collet with a simple constitution, a bond head device, and also a collet position adjusting method.SOLUTION: In a collet position adjusting method, a bond head device, and a die bonder, the bond head device comprises: a holder 41h for bringing inside vacuum; a shank 41s detachably/attachably mounted to a tip of the holder; and a collet 41c. To adjust a position of the collet after changing the collet in the bond head device, before changing the collet, a rear face of the collet is imaged by a rear face imaging camera 42 arranged at a lower part of the bond head device and whose optical system is constituted by a non-telecentric lens. After changing the collet, the rear face of the changed collet is imaged by the rear face imaging camera, and therefore, the position of the collet is corrected so that the image of the collet remains the same before and after changing.