PLASMA PROCESSING APPARATUS

PROBLEM TO BE SOLVED: To provide a plasma processing apparatus capable of inhibiting the adhesion of foreign matter to a gas supply channel surface and the pollution of the gas supply channel surface.SOLUTION: A plasma processing apparatus includes: a vacuum case 14; a processing chamber for perform...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HASHIMOTO TAKAHISA, SAKAI YOSUKE, ARASE TAKAO, YOKOGAWA KATANOBU, MORI MASASHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a plasma processing apparatus capable of inhibiting the adhesion of foreign matter to a gas supply channel surface and the pollution of the gas supply channel surface.SOLUTION: A plasma processing apparatus includes: a vacuum case 14; a processing chamber for performing surface treatment of a sample-to-be-processed 2 by plasma; sample-to-be-treated-and-processed installation means 1; an upper electrode 3 that has a gas channel 102 and a large number of micropores 6; a gas shield plate 103 that is arranged within the gas channel 102 of the upper electrode 3 to open/close the micropores 6; and a drive unit 101 for driving the gas shield plate 103.