COMMUNICATION MODULE AND SIGNAL TRANSMISSION DEVICE PROVIDED WITH THE SAME

COMMUNICATION MODULE AND SIGNAL TRANSMISSION DEVICE PROVIDED WITH THE SAME

PROBLEM TO BE SOLVED: To secure a space usable for various applications between a substrate and a communication module mounted on the substrate.SOLUTION: A communication module 10 to be mounted on a mother board 3 in a signal transmission device includes a lower plate 31a and an upper plate 32a that...

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Hauptverfasser: YAMAZAKI KINYA, OKUBO CHIHIRO, SUNAGA YOSHINORI, ISHIGAMI YOSHIAKI
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
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creator YAMAZAKI KINYA
OKUBO CHIHIRO
SUNAGA YOSHINORI
ISHIGAMI YOSHIAKI
description PROBLEM TO BE SOLVED: To secure a space usable for various applications between a substrate and a communication module mounted on the substrate.SOLUTION: A communication module 10 to be mounted on a mother board 3 in a signal transmission device includes a lower plate 31a and an upper plate 32a that face each other, and has: a module casing 11 that has a module substrate 34 accommodated between the lower plate 31a and the upper plate 32a; and a male connector 60 that protrudes from the lower plate 31a, and is connected to a female connector 50 provided on the mother board 3. When the male connector 60 is connected to the female connector 50, a gap 70 is formed between the lower plate 31a of the module casing 11 and the mother board 3.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
title COMMUNICATION MODULE AND SIGNAL TRANSMISSION DEVICE PROVIDED WITH THE SAME
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