COMMUNICATION MODULE AND SIGNAL TRANSMISSION DEVICE PROVIDED WITH THE SAME

PROBLEM TO BE SOLVED: To secure a space usable for various applications between a substrate and a communication module mounted on the substrate.SOLUTION: A communication module 10 to be mounted on a mother board 3 in a signal transmission device includes a lower plate 31a and an upper plate 32a that...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAZAKI KINYA, OKUBO CHIHIRO, SUNAGA YOSHINORI, ISHIGAMI YOSHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To secure a space usable for various applications between a substrate and a communication module mounted on the substrate.SOLUTION: A communication module 10 to be mounted on a mother board 3 in a signal transmission device includes a lower plate 31a and an upper plate 32a that face each other, and has: a module casing 11 that has a module substrate 34 accommodated between the lower plate 31a and the upper plate 32a; and a male connector 60 that protrudes from the lower plate 31a, and is connected to a female connector 50 provided on the mother board 3. When the male connector 60 is connected to the female connector 50, a gap 70 is formed between the lower plate 31a of the module casing 11 and the mother board 3.