POLISHING DEVICE AND POLISHING PAD BONDING METHOD

PROBLEM TO BE SOLVED: To provide a polishing device which enables easy replacement of a bonded polishing pad and inhibits heat damage from occurring in a polishing table.SOLUTION: A polishing device includes a polishing table 110 having a bonding surface 110a to which a polishing pad 108 for polishi...

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Bibliographische Detailangaben
Hauptverfasser:	ISOBE SOICHI, KOSUGE RYUICHI, SONE CHUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a polishing device which enables easy replacement of a bonded polishing pad and inhibits heat damage from occurring in a polishing table.SOLUTION: A polishing device includes a polishing table 110 having a bonding surface 110a to which a polishing pad 108 for polishing a substrate is bonded. Further, the polishing device includes a silicone layer 111 which is provided on the bonding surface 110a of the polishing table 110 and is disposed between the polishing table 110 and the polishing pad 108. Disposing the silicone layer 111 between the polishing table 110 and the polishing pad 108 enables easy peeling and bonding of the polishing pad 108. Since heat treatment for coating the polishing table 110 with the silicone layer 111 is performed at a relatively low temperature, heat damage is inhibited from being caused in the polishing table 110 by the heat treatment.