METHOD AND APPARATUS FOR REDUCING METAL OXIDES ON METAL SEED LAYER

PROBLEM TO BE SOLVED: To provide a method and apparatus for reducing a metal oxide surface of a seed layer for plating to a modified metal surface.SOLUTION: A metal seed layer for plating, a part of which is oxidized to a metal oxide, is exposed to remote plasma comprising one or more of radicals, i...

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Bibliographische Detailangaben
Hauptverfasser:	JONATHAN D REID, DAVID PORTER, DURGALAKSHMI SINGHAL, NATALIA V DOUBINA, JAMES E DUNCAN, DARCY E LAMBERT, GEORGE ANDREW ANTONELLI, TIGHE A SPURLIN, STEPHEN LAU, MARSHALL STOWELL
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method and apparatus for reducing a metal oxide surface of a seed layer for plating to a modified metal surface.SOLUTION: A metal seed layer for plating, a part of which is oxidized to a metal oxide, is exposed to remote plasma comprising one or more of radicals, ions, and UV radiation of a reducing gas, thereby reducing a metal oxide surface on a substrate to a metal in the form of a film integrated with the metal seed layer.