SUBSTRATE SUPPORT DEVICE
PROBLEM TO BE SOLVED: To provide a substrate support device capable of preventing occurrence of defects such as deformation due to thermal strain of a heater plate and improving the temperature uniformity of a wafer by uniformly heating the heater plate when the wafer is heat treated.SOLUTION: A sub...
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| creator | HANAMACHI TOSHIHIKO ISHIOKA YASUAKI HASHIMOTO DAISUKE |
| description | PROBLEM TO BE SOLVED: To provide a substrate support device capable of preventing occurrence of defects such as deformation due to thermal strain of a heater plate and improving the temperature uniformity of a wafer by uniformly heating the heater plate when the wafer is heat treated.SOLUTION: A substrate support device comprises: a plate section including a heater plate having a heat generating body therein, a first cooling plate that is disposed on the lower surface of the heater plate and that has a first flow path, and a second cooling plate that is disposed on the upper surface of the heater plate and that has a second flow path; wiring that is connected to the heat generating body and that supplies current to the heat generating body; and a shaft section that has piping supplying refrigerant to the first flow path and the second flow path therein and that supports the plate section. The first flow path includes a spiral flow path that goes around in the first direction toward the outer edge from the central part of the first cooling plate and the second flow path includes a spiral flow path that goes around in the second direction that is an opposite direction to the first direction toward the outer edge from the central part of the second cooling plate. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2014175491A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2014175491A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2014175491A3</originalsourceid><addsrcrecordid>eNrjZJAIDnUKDglyDHFVCA4NCPAPClFwcQ3zdHblYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoYmhuamJpaGjsZEKQIASosgYQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SUBSTRATE SUPPORT DEVICE</title><source>esp@cenet</source><creator>HANAMACHI TOSHIHIKO ; ISHIOKA YASUAKI ; HASHIMOTO DAISUKE</creator><creatorcontrib>HANAMACHI TOSHIHIKO ; ISHIOKA YASUAKI ; HASHIMOTO DAISUKE</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a substrate support device capable of preventing occurrence of defects such as deformation due to thermal strain of a heater plate and improving the temperature uniformity of a wafer by uniformly heating the heater plate when the wafer is heat treated.SOLUTION: A substrate support device comprises: a plate section including a heater plate having a heat generating body therein, a first cooling plate that is disposed on the lower surface of the heater plate and that has a first flow path, and a second cooling plate that is disposed on the upper surface of the heater plate and that has a second flow path; wiring that is connected to the heat generating body and that supplies current to the heat generating body; and a shaft section that has piping supplying refrigerant to the first flow path and the second flow path therein and that supports the plate section. The first flow path includes a spiral flow path that goes around in the first direction toward the outer edge from the central part of the first cooling plate and the second flow path includes a spiral flow path that goes around in the second direction that is an opposite direction to the first direction toward the outer edge from the central part of the second cooling plate.</description><language>eng</language><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SPRAYING OR ATOMISING IN GENERAL ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; TRANSPORTING</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140922&DB=EPODOC&CC=JP&NR=2014175491A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140922&DB=EPODOC&CC=JP&NR=2014175491A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HANAMACHI TOSHIHIKO</creatorcontrib><creatorcontrib>ISHIOKA YASUAKI</creatorcontrib><creatorcontrib>HASHIMOTO DAISUKE</creatorcontrib><title>SUBSTRATE SUPPORT DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a substrate support device capable of preventing occurrence of defects such as deformation due to thermal strain of a heater plate and improving the temperature uniformity of a wafer by uniformly heating the heater plate when the wafer is heat treated.SOLUTION: A substrate support device comprises: a plate section including a heater plate having a heat generating body therein, a first cooling plate that is disposed on the lower surface of the heater plate and that has a first flow path, and a second cooling plate that is disposed on the upper surface of the heater plate and that has a second flow path; wiring that is connected to the heat generating body and that supplies current to the heat generating body; and a shaft section that has piping supplying refrigerant to the first flow path and the second flow path therein and that supports the plate section. The first flow path includes a spiral flow path that goes around in the first direction toward the outer edge from the central part of the first cooling plate and the second flow path includes a spiral flow path that goes around in the second direction that is an opposite direction to the first direction toward the outer edge from the central part of the second cooling plate.</description><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAIDnUKDglyDHFVCA4NCPAPClFwcQ3zdHblYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoYmhuamJpaGjsZEKQIASosgYQ</recordid><startdate>20140922</startdate><enddate>20140922</enddate><creator>HANAMACHI TOSHIHIKO</creator><creator>ISHIOKA YASUAKI</creator><creator>HASHIMOTO DAISUKE</creator><scope>EVB</scope></search><sort><creationdate>20140922</creationdate><title>SUBSTRATE SUPPORT DEVICE</title><author>HANAMACHI TOSHIHIKO ; ISHIOKA YASUAKI ; HASHIMOTO DAISUKE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2014175491A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HANAMACHI TOSHIHIKO</creatorcontrib><creatorcontrib>ISHIOKA YASUAKI</creatorcontrib><creatorcontrib>HASHIMOTO DAISUKE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HANAMACHI TOSHIHIKO</au><au>ISHIOKA YASUAKI</au><au>HASHIMOTO DAISUKE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE SUPPORT DEVICE</title><date>2014-09-22</date><risdate>2014</risdate><abstract>PROBLEM TO BE SOLVED: To provide a substrate support device capable of preventing occurrence of defects such as deformation due to thermal strain of a heater plate and improving the temperature uniformity of a wafer by uniformly heating the heater plate when the wafer is heat treated.SOLUTION: A substrate support device comprises: a plate section including a heater plate having a heat generating body therein, a first cooling plate that is disposed on the lower surface of the heater plate and that has a first flow path, and a second cooling plate that is disposed on the upper surface of the heater plate and that has a second flow path; wiring that is connected to the heat generating body and that supplies current to the heat generating body; and a shaft section that has piping supplying refrigerant to the first flow path and the second flow path therein and that supports the plate section. The first flow path includes a spiral flow path that goes around in the first direction toward the outer edge from the central part of the first cooling plate and the second flow path includes a spiral flow path that goes around in the second direction that is an opposite direction to the first direction toward the outer edge from the central part of the second cooling plate.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING |
| title | SUBSTRATE SUPPORT DEVICE |
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