SUBSTRATE FOR SUSPENSION, SUSPENSION, SUSPENSION WITH ELEMENT, HARD DISK DRIVE, AND METHOD FOR MANUFACTURING SUBSTRATE FOR SUSPENSION

PROBLEM TO BE SOLVED: To prevent an occurrence of short circuit caused by solder between terminal parts when a solder bump is formed on a terminal part provided in a substrate for suspension.SOLUTION: The substrate for suspension includes: a metal support substrate; an insulation layer formed on the metal support substrate; and a wiring layer formed on the insulation layer. The wiring layer includes a terminal part to be connected to an external circuit board, and the terminal part includes a terminal opening part. In the plan view, the insulation layer has an insulation layer opening part at a position superposed with at least a part of the terminal opening part, and a wettability improving plating layer is formed on the surface of the metal support substrate that is exposed from the insulation layer opening part.