EPOXY RESIN, CURABLE RESIN COMPOSITION AND ITS CURED BODY AND SEMICONDUCTOR SEALING MATERIAL

PROBLEM TO BE SOLVED: To provide an epoxy resin excellent in fire resistance and metal substrate adhesiveness, a curable resin composition using the same, its cured body and a sealing material.SOLUTION: There is provided an epoxy resin having a skeleton which a cyclohexadienone skeleton represented...

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1. Verfasser:	HIROTA YOSUKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin excellent in fire resistance and metal substrate adhesiveness, a curable resin composition using the same, its cured body and a sealing material.SOLUTION: There is provided an epoxy resin having a skeleton which a cyclohexadienone skeleton represented by the structure formula (a), where R1 represents any of a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, and a glycidyloxy group, is connected to another naphthalene skeleton through an aromatic nucleus-containing hydrocarbon group, and providing a cured body having effectively alleviated stress, excellent in substrate adhesiveness and having high fire resistance and metal substrate adhesiveness by elongating a distance between naphthol skeletons.