METHOD FOR PROCESSING WAFER

PROBLEM TO BE SOLVED: To provide a method for processing a wafer which, when separating a device area from a ring-shaped reinforcement portion, eliminates or reduces breakage due to contact between the ring-shaped reinforcement portion and a cutting blade and eliminates the need for a large projecti...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TOIDA YOSHITAMA, SAKAI MAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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