METHOD FOR PROCESSING WAFER

PROBLEM TO BE SOLVED: To provide a method for processing a wafer which, when separating a device area from a ring-shaped reinforcement portion, eliminates or reduces breakage due to contact between the ring-shaped reinforcement portion and a cutting blade and eliminates the need for a large projection amount of a cutting edge of the cutting blade.SOLUTION: A method for processing a wafer having a device area having a plurality of devices formed therein and an outer circumference excessive area surrounding the device area on a surface of the wafer, comprises: a holding step of holding a rear face side of the wafer supported by an annular frame F by a chuck table 32 to expose a base material side of a dicing tape T; a ring-shaped reinforcement portion separating step of cutting a boundary between a ring-shaped reinforcement portion including the outer circumference excessive area and the device area together with the dicing tape T to separate the device area from the ring-shaped reinforcement portion by causing the cutting blade 44 to cut into the wafer from a side of the dicing tape T; and a ring-shaped reinforcement removing step of removing the ring-shaped reinforcement portion together with the annular frame F from the chuck table 32.