METHOD FOR PROCESSING WAFER
PROBLEM TO BE SOLVED: To provide a method for processing a wafer which, when separating a device area from a ring-shaped reinforcement portion, eliminates or reduces breakage due to contact between the ring-shaped reinforcement portion and a cutting blade and eliminates the need for a large projecti...
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| creator | TOIDA YOSHITAMA SAKAI MAKI |
| description | PROBLEM TO BE SOLVED: To provide a method for processing a wafer which, when separating a device area from a ring-shaped reinforcement portion, eliminates or reduces breakage due to contact between the ring-shaped reinforcement portion and a cutting blade and eliminates the need for a large projection amount of a cutting edge of the cutting blade.SOLUTION: A method for processing a wafer having a device area having a plurality of devices formed therein and an outer circumference excessive area surrounding the device area on a surface of the wafer, comprises: a holding step of holding a rear face side of the wafer supported by an annular frame F by a chuck table 32 to expose a base material side of a dicing tape T; a ring-shaped reinforcement portion separating step of cutting a boundary between a ring-shaped reinforcement portion including the outer circumference excessive area and the device area together with the dicing tape T to separate the device area from the ring-shaped reinforcement portion by causing the cutting blade 44 to cut into the wafer from a side of the dicing tape T; and a ring-shaped reinforcement removing step of removing the ring-shaped reinforcement portion together with the annular frame F from the chuck table 32. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2014170798A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2014170798A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2014170798A3</originalsourceid><addsrcrecordid>eNrjZJD2dQ3x8HdRcPMPUggI8nd2DQ729HNXCHd0cw3iYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoYmhuYG5pYWjsZEKQIAj-wg_g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR PROCESSING WAFER</title><source>esp@cenet</source><creator>TOIDA YOSHITAMA ; SAKAI MAKI</creator><creatorcontrib>TOIDA YOSHITAMA ; SAKAI MAKI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a method for processing a wafer which, when separating a device area from a ring-shaped reinforcement portion, eliminates or reduces breakage due to contact between the ring-shaped reinforcement portion and a cutting blade and eliminates the need for a large projection amount of a cutting edge of the cutting blade.SOLUTION: A method for processing a wafer having a device area having a plurality of devices formed therein and an outer circumference excessive area surrounding the device area on a surface of the wafer, comprises: a holding step of holding a rear face side of the wafer supported by an annular frame F by a chuck table 32 to expose a base material side of a dicing tape T; a ring-shaped reinforcement portion separating step of cutting a boundary between a ring-shaped reinforcement portion including the outer circumference excessive area and the device area together with the dicing tape T to separate the device area from the ring-shaped reinforcement portion by causing the cutting blade 44 to cut into the wafer from a side of the dicing tape T; and a ring-shaped reinforcement removing step of removing the ring-shaped reinforcement portion together with the annular frame F from the chuck table 32.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140918&DB=EPODOC&CC=JP&NR=2014170798A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140918&DB=EPODOC&CC=JP&NR=2014170798A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TOIDA YOSHITAMA</creatorcontrib><creatorcontrib>SAKAI MAKI</creatorcontrib><title>METHOD FOR PROCESSING WAFER</title><description>PROBLEM TO BE SOLVED: To provide a method for processing a wafer which, when separating a device area from a ring-shaped reinforcement portion, eliminates or reduces breakage due to contact between the ring-shaped reinforcement portion and a cutting blade and eliminates the need for a large projection amount of a cutting edge of the cutting blade.SOLUTION: A method for processing a wafer having a device area having a plurality of devices formed therein and an outer circumference excessive area surrounding the device area on a surface of the wafer, comprises: a holding step of holding a rear face side of the wafer supported by an annular frame F by a chuck table 32 to expose a base material side of a dicing tape T; a ring-shaped reinforcement portion separating step of cutting a boundary between a ring-shaped reinforcement portion including the outer circumference excessive area and the device area together with the dicing tape T to separate the device area from the ring-shaped reinforcement portion by causing the cutting blade 44 to cut into the wafer from a side of the dicing tape T; and a ring-shaped reinforcement removing step of removing the ring-shaped reinforcement portion together with the annular frame F from the chuck table 32.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD2dQ3x8HdRcPMPUggI8nd2DQ729HNXCHd0cw3iYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoYmhuYG5pYWjsZEKQIAj-wg_g</recordid><startdate>20140918</startdate><enddate>20140918</enddate><creator>TOIDA YOSHITAMA</creator><creator>SAKAI MAKI</creator><scope>EVB</scope></search><sort><creationdate>20140918</creationdate><title>METHOD FOR PROCESSING WAFER</title><author>TOIDA YOSHITAMA ; SAKAI MAKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2014170798A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>TOIDA YOSHITAMA</creatorcontrib><creatorcontrib>SAKAI MAKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TOIDA YOSHITAMA</au><au>SAKAI MAKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR PROCESSING WAFER</title><date>2014-09-18</date><risdate>2014</risdate><abstract>PROBLEM TO BE SOLVED: To provide a method for processing a wafer which, when separating a device area from a ring-shaped reinforcement portion, eliminates or reduces breakage due to contact between the ring-shaped reinforcement portion and a cutting blade and eliminates the need for a large projection amount of a cutting edge of the cutting blade.SOLUTION: A method for processing a wafer having a device area having a plurality of devices formed therein and an outer circumference excessive area surrounding the device area on a surface of the wafer, comprises: a holding step of holding a rear face side of the wafer supported by an annular frame F by a chuck table 32 to expose a base material side of a dicing tape T; a ring-shaped reinforcement portion separating step of cutting a boundary between a ring-shaped reinforcement portion including the outer circumference excessive area and the device area together with the dicing tape T to separate the device area from the ring-shaped reinforcement portion by causing the cutting blade 44 to cut into the wafer from a side of the dicing tape T; and a ring-shaped reinforcement removing step of removing the ring-shaped reinforcement portion together with the annular frame F from the chuck table 32.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | METHOD FOR PROCESSING WAFER |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T18%3A05%3A42IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TOIDA%20YOSHITAMA&rft.date=2014-09-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2014170798A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |