MOLDING

PROBLEM TO BE SOLVED: To provide a molding excellent in stress crack resistance.SOLUTION: The molding contains: an ethylenic copolymer which contains a polymerization unit derived from ethylene and a polymerization unit derived from at least one copolymerization compound selected from the group cons...

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Bibliographische Detailangaben
Hauptverfasser: TANAKA RIYOUJI, SATO KAZUISHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a molding excellent in stress crack resistance.SOLUTION: The molding contains: an ethylenic copolymer which contains a polymerization unit derived from ethylene and a polymerization unit derived from at least one copolymerization compound selected from the group consisting of a vinyl ester, an unsaturated carboxylic acid, a derivative of a vinyl ester, and a derivative of an unsaturated carboxylic acid, wherein the content ratio of the polymerization unit derived from the copolymerization compound is 5-50 mass%; and cellulosic fibers having an average fiber diameter of 500 nm or less. The cellulosic fibers are contained in an amount of 0.5-10 pts.mass based on 100 pts.mass of the ethylenic copolymer.