SILICONE COMPOSITION FOR SEALING LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE

PROBLEM TO BE SOLVED: To provide a silicone composition for sealing a light emitting element, excellent in adhesiveness to a support base material, and a light emitting device including a light emitting element sealed by a cured product of the silicone composition.SOLUTION: A silicone composition fo...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MOCHIZUKI KIKUO, HIRAI NOBUO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a silicone composition for sealing a light emitting element, excellent in adhesiveness to a support base material, and a light emitting device including a light emitting element sealed by a cured product of the silicone composition.SOLUTION: A silicone composition for sealing a light emitting element contains (A) a vinyl group-containing organopolysiloxane with a three-dimensional network structure which is a solid at 25°C and is represented by an average unit formula: (SiO)(ViRSiO)(RSiO), (A) a linear alkenyl group-containing organopolysiloxane, (B) an organohydrogenpolysiloxane which has two or more hydrogen atoms, each hydrogen atom being bonded to a silicon atom, (C) a catalyst for a hydrosilylation reaction, and a reaction product of a silane represented by formula: CH=C(CH)COO(CH)Si(OCH)and an organosiloxane represented by formula: [(CH)HSiO](CH)SiO. The silicone composition does not contain fillers, and has a coefficient of linear expansion after curing of 10-290×10/°C.