METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device by resin sealing a semiconductor element mounted on a lead frame, which allows for reduction in the frequency of cleaning work of a mold as much as possible, by preventing a sealing resin from adhering to or remaining...

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Bibliographische Detailangaben
1. Verfasser:	ISHIBASHI TAKAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device by resin sealing a semiconductor element mounted on a lead frame, which allows for reduction in the frequency of cleaning work of a mold as much as possible, by preventing a sealing resin from adhering to or remaining in the mold.SOLUTION: A method of manufacturing a semiconductor device includes: an etching step for forming a lead frame 1 by forming a lead pattern for a strip lead frame material lM by etching, and forming a dimple 1d at a position 1g of the mold facing an air vent; following the etching step, a side cut step for side-cutting the edge 1g of the mold facing an air vent in the lead frame 1; and, following the side cut step, a mold step for resin sealing for the lead frame 1 in the mold.