ELECTROMAGNETIC WAVE SHIELD MATERIAL FOR FPC

PROBLEM TO BE SOLVED: To provide an electromagnetic wave shield material for FPC which ensures excellent adhesion force between a substrate and a conductive paste layer and a conductive adhesive layer, prevents partial delamination of an adhesive interface of the substrate and conductive paste even...

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Bibliographische Detailangaben
Hauptverfasser:	FUJII SANAE, NOMURA NAOHIRO, SAKURAGI TAKANORI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TELEPHONIC COMMUNICATION TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electromagnetic wave shield material for FPC which ensures excellent adhesion force between a substrate and a conductive paste layer and a conductive adhesive layer, prevents partial delamination of an adhesive interface of the substrate and conductive paste even if bending operation is repeated, and suppresses degradation in electromagnetic wave shielding performance over time.SOLUTION: An electromagnetic wave shield material 10 includes a substrate 1 consisting of a coated thin resin film of a dielectric, an anchor coat layer 2, a conductive paste layer 3, and a conductive adhesive layer 4, laminated in order on one side of a support film 6. A portion of the conductive adhesive layer 4 contains a component which can penetrate into the anchor coat layer 2 and/or a conductive paste layer 3 and can be cured. The conductive adhesive layer 4 preferably contains an epoxy resin having a number-average molecular weight of 1500 or less.