COOLING DEVICE AND ELECTRONIC EQUIPMENT MOUNTED WITH THE SAME

PROBLEM TO BE SOLVED: To provide a heat pipe type cooling device for cooling efficiently.SOLUTION: A cooling device is configured by: a hollow base part 10 in which a heat receiving part 3 is provided where a heating element 52 is attached on one surface; a plurality of hollow heat radiation pins 5...

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Bibliographische Detailangaben
Hauptverfasser:	MATSUI MASAFUMI, SUZUKI AYAKA, SUGIYAMA MAKOTO, YASUI NOBUYUKI, SHIBATA HIROSHI, HOSONO SHIGEYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a heat pipe type cooling device for cooling efficiently.SOLUTION: A cooling device is configured by: a hollow base part 10 in which a heat receiving part 3 is provided where a heating element 52 is attached on one surface; a plurality of hollow heat radiation pins 5 which are protrusively provided on a surface facing the heat receiving part 3 of the base part 10 and whose inside communicates with the inside of the base part 10; and hydraulic fluid 11 sealed inside the base part 10 and the heat radiation pin 5. An inner wall of the heat radiation pin 5 is made to be a taper-shape so that an inside diameter of the heat radiation pin 5 becomes larger from a tip part toward the base part 10 side. Thus, cooling can be performed efficiently.