MICROSTRUCTURE MOLDING METHOD AND MICROSTRUCTURE MOLDING DIE

PROBLEM TO BE SOLVED: To provide a method and a mold that can mold a planar microstructure in which there is not a burr in an edge end part, and also a fine structure is performed by transfer molding to a plane part and one edge end part.SOLUTION: A microstructure molding method is a method in which...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: OCHI SHOTA, ITO HIROSHI, NAITO AKIHIRO, YAKIMOTO KAZUTOSHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method and a mold that can mold a planar microstructure in which there is not a burr in an edge end part, and also a fine structure is performed by transfer molding to a plane part and one edge end part.SOLUTION: A microstructure molding method is a method in which a coated film formed by applying a molten resin to a lower mold is pressing-forced by an upper mold, a fine structure is performed by transfer molding to a plane part and one edge end part of the coated film, performed by cooling solidification, and thereby the planar microstructure in which the fine structure is possessed in the plane part and the one edge end part and there is not a burr in the one edge end part is molded, and is enforced by performing a step in which a planar coated film is formed in the lower mold, and a step in which the upper mold is inclined from a horizontal plane and a tip of a bottom edge thereof is made to contact the lower mold, then made to revolve centering the contact part until the upper mold becomes horizontal, and pressing-forced, thereby the fine structure is performed by transfer molding to the plane part and the one edge end part of the coated film.