ABRASIVE LIQUID SUPPLY DEVICE, AND SUBSTRATE TREATMENT DEVICE

PROBLEM TO BE SOLVED: To suppress deterioration of accuracy of flow rate detection caused by air bubbles generated in a polishing abrasive liquid.SOLUTION: An abrasive liquid supply device 200 includes: abrasive liquid piping 210 for supplying a polishing abrasive liquid 205 to a polishing table 110...

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1. Verfasser: KOMATSU MITSUNORI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To suppress deterioration of accuracy of flow rate detection caused by air bubbles generated in a polishing abrasive liquid.SOLUTION: An abrasive liquid supply device 200 includes: abrasive liquid piping 210 for supplying a polishing abrasive liquid 205 to a polishing table 110 having a polishing surface for polishing a substrate; a pump 230 which supplies the polishing abrasive liquid 205 through the abrasive liquid piping 210 to the polishing table 110; an ultrasonic flowmeter 240 which measures a flow rate of the polishing abrasive liquid 205 flowing in the abrasive liquid piping 210; and a control part 250. The control part 250 controls a pressure of the polishing abrasive liquid 205 in the abrasive liquid piping 210 so as not to mix the polishing abrasive liquid and the air bubbles on a surface orthogonal to a flow direction of the polishing abrasive liquid 205 in a measurement region for measuring the flow rate of the polishing abrasive liquid 205 by the ultrasonic flowmeter 240. By suppressing generation of such the air bubbles, accumulation of the polishing abrasive liquid 205 in the abrasive liquid piping 210 is suppressed. As a result, deterioration of accuracy of flow rate detection is suppressed.