WIRE SAW

PROBLEM TO BE SOLVED: To provide a wire saw having excellent processing accuracy and durability.SOLUTION: A wire saw 1 is to cut a workpiece W by pressing the workpiece W against a traveling wire 3. A wire 3 is entrained around a plurality of columnar wire guides 2R and 2L to be rotated around a rot...

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Bibliographische Detailangaben
Hauptverfasser:	HOSHIYAMA TOYOHIRO, HAMAZAKI TATSUMI
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a wire saw having excellent processing accuracy and durability.SOLUTION: A wire saw 1 is to cut a workpiece W by pressing the workpiece W against a traveling wire 3. A wire 3 is entrained around a plurality of columnar wire guides 2R and 2L to be rotated around a rotation axis A. The wire 3 is entrained around a guide groove 11 so as to ensure that wire rows 10 arranged in parallel at the same pitch P are formed between the pair of wire guides 2R and 2L. The wire rows 10 are inclined with respect to the rotation axis A as viewed from an orthogonal direction.