MULTIPLE MOUNTED COMPONENT OF LEAD FRAME WITH RESIN, AND MULTIPLE MOUNTED COMPONENT OF OPTICAL SEMICONDUCTOR DEVICE

MULTIPLE MOUNTED COMPONENT OF LEAD FRAME WITH RESIN, AND MULTIPLE MOUNTED COMPONENT OF OPTICAL SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a multiple mounted component of a lead frame with a resin, capable of preventing damage or defacement of a part to be a product even if they are directly overlapped with each other, and a multiple mounted component of an optical semiconductor device.SOLUTION: A multi...

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Hauptverfasser: ODA KAZUNORI, OISHI MEGUMI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator ODA KAZUNORI
OISHI MEGUMI
description PROBLEM TO BE SOLVED: To provide a multiple mounted component of a lead frame with a resin, capable of preventing damage or defacement of a part to be a product even if they are directly overlapped with each other, and a multiple mounted component of an optical semiconductor device.SOLUTION: A multiple mounted component R of a lead frame with a resin comprises: a multiple mounted component MS of the lead frame having a plurality of terminal parts 11, 12, and in which a lead frame 10 used for an optical semiconductor device 1 in which an LED element 2 is connected to a surface of at least one of terminal parts 11, 12, is multiple-mounted on a frame F; and a light-reflecting resin layer 20 having a frame resin part 20a formed on an outer peripheral side surface and between terminal parts of the lead frame 10, and a projection resin part 20b projecting to at least of a part on opposite sides forming an outer shape of the frame F on a front surface of a back surface of the frame F.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2014160768A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2014160768A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2014160768A3</originalsourceid><addsrcrecordid>eNqNy7EKwjAQgOEuDqK-w-Gs0KpU15BcaCTJhfSiYykSJ9FCfH9cnMXpX75_XhWXLJtgERwlz6hAkgvk0TOQBotCgY7CIVwNdxCxN34Dwiv4PVJgI4WFHp2R5FWSTBEUXozEZTW7j4-SV98uqrVGlt02T68hl2m85Wd-D-ewq5tD09bH9iT2f6EP-BU5LA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MULTIPLE MOUNTED COMPONENT OF LEAD FRAME WITH RESIN, AND MULTIPLE MOUNTED COMPONENT OF OPTICAL SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>ODA KAZUNORI ; OISHI MEGUMI</creator><creatorcontrib>ODA KAZUNORI ; OISHI MEGUMI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a multiple mounted component of a lead frame with a resin, capable of preventing damage or defacement of a part to be a product even if they are directly overlapped with each other, and a multiple mounted component of an optical semiconductor device.SOLUTION: A multiple mounted component R of a lead frame with a resin comprises: a multiple mounted component MS of the lead frame having a plurality of terminal parts 11, 12, and in which a lead frame 10 used for an optical semiconductor device 1 in which an LED element 2 is connected to a surface of at least one of terminal parts 11, 12, is multiple-mounted on a frame F; and a light-reflecting resin layer 20 having a frame resin part 20a formed on an outer peripheral side surface and between terminal parts of the lead frame 10, and a projection resin part 20b projecting to at least of a part on opposite sides forming an outer shape of the frame F on a front surface of a back surface of the frame F.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140904&amp;DB=EPODOC&amp;CC=JP&amp;NR=2014160768A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140904&amp;DB=EPODOC&amp;CC=JP&amp;NR=2014160768A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ODA KAZUNORI</creatorcontrib><creatorcontrib>OISHI MEGUMI</creatorcontrib><title>MULTIPLE MOUNTED COMPONENT OF LEAD FRAME WITH RESIN, AND MULTIPLE MOUNTED COMPONENT OF OPTICAL SEMICONDUCTOR DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a multiple mounted component of a lead frame with a resin, capable of preventing damage or defacement of a part to be a product even if they are directly overlapped with each other, and a multiple mounted component of an optical semiconductor device.SOLUTION: A multiple mounted component R of a lead frame with a resin comprises: a multiple mounted component MS of the lead frame having a plurality of terminal parts 11, 12, and in which a lead frame 10 used for an optical semiconductor device 1 in which an LED element 2 is connected to a surface of at least one of terminal parts 11, 12, is multiple-mounted on a frame F; and a light-reflecting resin layer 20 having a frame resin part 20a formed on an outer peripheral side surface and between terminal parts of the lead frame 10, and a projection resin part 20b projecting to at least of a part on opposite sides forming an outer shape of the frame F on a front surface of a back surface of the frame F.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNy7EKwjAQgOEuDqK-w-Gs0KpU15BcaCTJhfSiYykSJ9FCfH9cnMXpX75_XhWXLJtgERwlz6hAkgvk0TOQBotCgY7CIVwNdxCxN34Dwiv4PVJgI4WFHp2R5FWSTBEUXozEZTW7j4-SV98uqrVGlt02T68hl2m85Wd-D-ewq5tD09bH9iT2f6EP-BU5LA</recordid><startdate>20140904</startdate><enddate>20140904</enddate><creator>ODA KAZUNORI</creator><creator>OISHI MEGUMI</creator><scope>EVB</scope></search><sort><creationdate>20140904</creationdate><title>MULTIPLE MOUNTED COMPONENT OF LEAD FRAME WITH RESIN, AND MULTIPLE MOUNTED COMPONENT OF OPTICAL SEMICONDUCTOR DEVICE</title><author>ODA KAZUNORI ; OISHI MEGUMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2014160768A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>ODA KAZUNORI</creatorcontrib><creatorcontrib>OISHI MEGUMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ODA KAZUNORI</au><au>OISHI MEGUMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MULTIPLE MOUNTED COMPONENT OF LEAD FRAME WITH RESIN, AND MULTIPLE MOUNTED COMPONENT OF OPTICAL SEMICONDUCTOR DEVICE</title><date>2014-09-04</date><risdate>2014</risdate><abstract>PROBLEM TO BE SOLVED: To provide a multiple mounted component of a lead frame with a resin, capable of preventing damage or defacement of a part to be a product even if they are directly overlapped with each other, and a multiple mounted component of an optical semiconductor device.SOLUTION: A multiple mounted component R of a lead frame with a resin comprises: a multiple mounted component MS of the lead frame having a plurality of terminal parts 11, 12, and in which a lead frame 10 used for an optical semiconductor device 1 in which an LED element 2 is connected to a surface of at least one of terminal parts 11, 12, is multiple-mounted on a frame F; and a light-reflecting resin layer 20 having a frame resin part 20a formed on an outer peripheral side surface and between terminal parts of the lead frame 10, and a projection resin part 20b projecting to at least of a part on opposite sides forming an outer shape of the frame F on a front surface of a back surface of the frame F.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title MULTIPLE MOUNTED COMPONENT OF LEAD FRAME WITH RESIN, AND MULTIPLE MOUNTED COMPONENT OF OPTICAL SEMICONDUCTOR DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-12T12%3A08%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ODA%20KAZUNORI&rft.date=2014-09-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2014160768A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true