MULTIPLE MOUNTED COMPONENT OF LEAD FRAME WITH RESIN, AND MULTIPLE MOUNTED COMPONENT OF OPTICAL SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a multiple mounted component of a lead frame with a resin, capable of preventing damage or defacement of a part to be a product even if they are directly overlapped with each other, and a multiple mounted component of an optical semiconductor device.SOLUTION: A multiple mounted component R of a lead frame with a resin comprises: a multiple mounted component MS of the lead frame having a plurality of terminal parts 11, 12, and in which a lead frame 10 used for an optical semiconductor device 1 in which an LED element 2 is connected to a surface of at least one of terminal parts 11, 12, is multiple-mounted on a frame F; and a light-reflecting resin layer 20 having a frame resin part 20a formed on an outer peripheral side surface and between terminal parts of the lead frame 10, and a projection resin part 20b projecting to at least of a part on opposite sides forming an outer shape of the frame F on a front surface of a back surface of the frame F.