MULTIPLE MOUNTED COMPONENT OF LEAD FRAME WITH RESIN, AND MULTIPLE MOUNTED COMPONENT OF OPTICAL SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a multiple mounted component of a lead frame with a resin capable of preventing damage or defacement of a part to be a product even if they are directly overlapped with each other, and a multiple mounted component of an optical semiconductor device.SOLUTION: A multip...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ODA KAZUNORI, OISHI MEGUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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