MULTIPLE MOUNTED COMPONENT OF LEAD FRAME WITH RESIN, AND MULTIPLE MOUNTED COMPONENT OF OPTICAL SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a multiple mounted component of a lead frame with a resin capable of preventing damage or defacement of a part to be a product even if they are directly overlapped with each other, and a multiple mounted component of an optical semiconductor device.SOLUTION: A multiple mounted component R of a lead frame with a resin comprises: a multiple mounted component MS of the lead frame having a plurality of terminal parts 11, 12, and in which a lead frame 10 used for an optical semiconductor device 1 in which an LED element 2 is connected is multiple-mounted on a frame F; and a light-reflecting resin layer 20 having a frame resin part 20a, a front surface resin part 20b-1 projecting to at least of a part on opposite sides forming an outer shape of the frame on a front surface of the frame, and a rear surface resin part 20b-2 formed at a position opposed to the front surface resin part across the frame on a rear surface of the frame. The front surface resin part is fitted to the rear surface resin part of an other multiple mounted component of the lead frame with the resin, and has a guide part P for guiding a relative displacement between the front surface and the rear surface resin parts.