NORMAL-TEMPERATURE BONDING APPARATUS, NORMAL-TEMPERATURE BONDING METHOD, FLATTENING APPARATUS, AND FLATTENING METHOD

NORMAL-TEMPERATURE BONDING APPARATUS, NORMAL-TEMPERATURE BONDING METHOD, FLATTENING APPARATUS, AND FLATTENING METHOD

PROBLEM TO BE SOLVED: To improve bonding reliability when bonding a plurality of substrates together.SOLUTION: A normal-temperature bonding apparatus includes: an activation device 16 which emits activation beams Ba and Bb with which a first surface 50 of a first substrate 52 and a second surface 40...

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Hauptverfasser: KURASHIMA YUICHI, TSUNO TAKESHI, IDE KENSUKE, UCHIUMI ATSUSHI, TAKAGI HIDEKI, GOTO TAKAYUKI, MAEDA ATSUHIKO
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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creator KURASHIMA YUICHI
TSUNO TAKESHI
IDE KENSUKE
UCHIUMI ATSUSHI
TAKAGI HIDEKI
GOTO TAKAYUKI
MAEDA ATSUHIKO
description PROBLEM TO BE SOLVED: To improve bonding reliability when bonding a plurality of substrates together.SOLUTION: A normal-temperature bonding apparatus includes: an activation device 16 which emits activation beams Ba and Bb with which a first surface 50 of a first substrate 52 and a second surface 40 of a second substrate 42 are irradiated; and a press-contact mechanism 15 which bonds the first substrate 52 and the second substrate 42 together by bringing the first surface 50 and the second surface 40 into contact with each other after the first surface 50 and the second surface 40 are irradiated with the activation beams Ba and Bb. The activation beams Ba and Bb contain neon atoms.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2014160741A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2014160741A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2014160741A3</originalsourceid><addsrcrecordid>eNrjZCjx8w_ydfTRDXH1DXANcgwJDXJVcPL3c_H0c1dwDAhwBAkF6yjgUeXrGuLh76Kj4ObjGBLi6oem0dHPBVkGopiHgTUtMac4lRdKczMoubmGOHvophbkx6cWFyQmp-allsR7BRgZGJoYmhmYmxg6GhOlCABl-jmg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>NORMAL-TEMPERATURE BONDING APPARATUS, NORMAL-TEMPERATURE BONDING METHOD, FLATTENING APPARATUS, AND FLATTENING METHOD</title><source>esp@cenet</source><creator>KURASHIMA YUICHI ; TSUNO TAKESHI ; IDE KENSUKE ; UCHIUMI ATSUSHI ; TAKAGI HIDEKI ; GOTO TAKAYUKI ; MAEDA ATSUHIKO</creator><creatorcontrib>KURASHIMA YUICHI ; TSUNO TAKESHI ; IDE KENSUKE ; UCHIUMI ATSUSHI ; TAKAGI HIDEKI ; GOTO TAKAYUKI ; MAEDA ATSUHIKO</creatorcontrib><description>PROBLEM TO BE SOLVED: To improve bonding reliability when bonding a plurality of substrates together.SOLUTION: A normal-temperature bonding apparatus includes: an activation device 16 which emits activation beams Ba and Bb with which a first surface 50 of a first substrate 52 and a second surface 40 of a second substrate 42 are irradiated; and a press-contact mechanism 15 which bonds the first substrate 52 and the second substrate 42 together by bringing the first surface 50 and the second surface 40 into contact with each other after the first surface 50 and the second surface 40 are irradiated with the activation beams Ba and Bb. The activation beams Ba and Bb contain neon atoms.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140904&amp;DB=EPODOC&amp;CC=JP&amp;NR=2014160741A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140904&amp;DB=EPODOC&amp;CC=JP&amp;NR=2014160741A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KURASHIMA YUICHI</creatorcontrib><creatorcontrib>TSUNO TAKESHI</creatorcontrib><creatorcontrib>IDE KENSUKE</creatorcontrib><creatorcontrib>UCHIUMI ATSUSHI</creatorcontrib><creatorcontrib>TAKAGI HIDEKI</creatorcontrib><creatorcontrib>GOTO TAKAYUKI</creatorcontrib><creatorcontrib>MAEDA ATSUHIKO</creatorcontrib><title>NORMAL-TEMPERATURE BONDING APPARATUS, NORMAL-TEMPERATURE BONDING METHOD, FLATTENING APPARATUS, AND FLATTENING METHOD</title><description>PROBLEM TO BE SOLVED: To improve bonding reliability when bonding a plurality of substrates together.SOLUTION: A normal-temperature bonding apparatus includes: an activation device 16 which emits activation beams Ba and Bb with which a first surface 50 of a first substrate 52 and a second surface 40 of a second substrate 42 are irradiated; and a press-contact mechanism 15 which bonds the first substrate 52 and the second substrate 42 together by bringing the first surface 50 and the second surface 40 into contact with each other after the first surface 50 and the second surface 40 are irradiated with the activation beams Ba and Bb. The activation beams Ba and Bb contain neon atoms.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZCjx8w_ydfTRDXH1DXANcgwJDXJVcPL3c_H0c1dwDAhwBAkF6yjgUeXrGuLh76Kj4ObjGBLi6oem0dHPBVkGopiHgTUtMac4lRdKczMoubmGOHvophbkx6cWFyQmp-allsR7BRgZGJoYmhmYmxg6GhOlCABl-jmg</recordid><startdate>20140904</startdate><enddate>20140904</enddate><creator>KURASHIMA YUICHI</creator><creator>TSUNO TAKESHI</creator><creator>IDE KENSUKE</creator><creator>UCHIUMI ATSUSHI</creator><creator>TAKAGI HIDEKI</creator><creator>GOTO TAKAYUKI</creator><creator>MAEDA ATSUHIKO</creator><scope>EVB</scope></search><sort><creationdate>20140904</creationdate><title>NORMAL-TEMPERATURE BONDING APPARATUS, NORMAL-TEMPERATURE BONDING METHOD, FLATTENING APPARATUS, AND FLATTENING METHOD</title><author>KURASHIMA YUICHI ; TSUNO TAKESHI ; IDE KENSUKE ; UCHIUMI ATSUSHI ; TAKAGI HIDEKI ; GOTO TAKAYUKI ; MAEDA ATSUHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2014160741A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>KURASHIMA YUICHI</creatorcontrib><creatorcontrib>TSUNO TAKESHI</creatorcontrib><creatorcontrib>IDE KENSUKE</creatorcontrib><creatorcontrib>UCHIUMI ATSUSHI</creatorcontrib><creatorcontrib>TAKAGI HIDEKI</creatorcontrib><creatorcontrib>GOTO TAKAYUKI</creatorcontrib><creatorcontrib>MAEDA ATSUHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KURASHIMA YUICHI</au><au>TSUNO TAKESHI</au><au>IDE KENSUKE</au><au>UCHIUMI ATSUSHI</au><au>TAKAGI HIDEKI</au><au>GOTO TAKAYUKI</au><au>MAEDA ATSUHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>NORMAL-TEMPERATURE BONDING APPARATUS, NORMAL-TEMPERATURE BONDING METHOD, FLATTENING APPARATUS, AND FLATTENING METHOD</title><date>2014-09-04</date><risdate>2014</risdate><abstract>PROBLEM TO BE SOLVED: To improve bonding reliability when bonding a plurality of substrates together.SOLUTION: A normal-temperature bonding apparatus includes: an activation device 16 which emits activation beams Ba and Bb with which a first surface 50 of a first substrate 52 and a second surface 40 of a second substrate 42 are irradiated; and a press-contact mechanism 15 which bonds the first substrate 52 and the second substrate 42 together by bringing the first surface 50 and the second surface 40 into contact with each other after the first surface 50 and the second surface 40 are irradiated with the activation beams Ba and Bb. The activation beams Ba and Bb contain neon atoms.</abstract><oa>free_for_read</oa></addata></record>
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recordid cdi_epo_espacenet_JP2014160741A
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subjects BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title NORMAL-TEMPERATURE BONDING APPARATUS, NORMAL-TEMPERATURE BONDING METHOD, FLATTENING APPARATUS, AND FLATTENING METHOD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-12T20%3A34%3A49IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KURASHIMA%20YUICHI&rft.date=2014-09-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2014160741A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true