NORMAL-TEMPERATURE BONDING APPARATUS, NORMAL-TEMPERATURE BONDING METHOD, FLATTENING APPARATUS, AND FLATTENING METHOD

PROBLEM TO BE SOLVED: To improve bonding reliability when bonding a plurality of substrates together.SOLUTION: A normal-temperature bonding apparatus includes: an activation device 16 which emits activation beams Ba and Bb with which a first surface 50 of a first substrate 52 and a second surface 40...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KURASHIMA YUICHI, TSUNO TAKESHI, IDE KENSUKE, UCHIUMI ATSUSHI, TAKAGI HIDEKI, GOTO TAKAYUKI, MAEDA ATSUHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve bonding reliability when bonding a plurality of substrates together.SOLUTION: A normal-temperature bonding apparatus includes: an activation device 16 which emits activation beams Ba and Bb with which a first surface 50 of a first substrate 52 and a second surface 40 of a second substrate 42 are irradiated; and a press-contact mechanism 15 which bonds the first substrate 52 and the second substrate 42 together by bringing the first surface 50 and the second surface 40 into contact with each other after the first surface 50 and the second surface 40 are irradiated with the activation beams Ba and Bb. The activation beams Ba and Bb contain neon atoms.