WIRING BOARD

PROBLEM TO BE SOLVED: To provide an art of reducing impact of a common mode in a wiring board having a differential transmission line pair.SOLUTION: A wiring board comprises: a first wiring layer including a differential transmission line pair 12; a second wiring layer 8 including a conductor region...

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Bibliographische Detailangaben
Hauptverfasser:	KAIZAKI YASUHIRO, NAKAZATO MAYUMI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an art of reducing impact of a common mode in a wiring board having a differential transmission line pair.SOLUTION: A wiring board comprises: a first wiring layer including a differential transmission line pair 12; a second wiring layer 8 including a conductor region 18; and a second insulation layer provided between the wiring layer and the second wiring layer 8. The second wiring layer 8 includes in the conductor region 18, non-conductor regions 20 each having a shape plane symmetric with respect to a symmetry plane 50 of the differential transmission line pair in the wiring layer. The plurality of non-conductor regions 20 are arranged in the second wiring layer 8 and the non-conductor regions are successively formed on the symmetry plane 50 of the differential transmission line pair 12.