SEMICONDUCTOR SOCKET

PROBLEM TO BE SOLVED: To provide a semiconductor socket capable of easily mounting/demounting a semiconductor element with high workability.SOLUTION: A main body 2 includes a formed guide groove 31 gradually inclining downward to the inside in the slide direction of cover members 3A, 3B that slides...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: OYA MASAAKI, KUDO YASUYUKI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a semiconductor socket capable of easily mounting/demounting a semiconductor element with high workability.SOLUTION: A main body 2 includes a formed guide groove 31 gradually inclining downward to the inside in the slide direction of cover members 3A, 3B that slides to the inside of the main body 2. Each of cover members 3A, 3B includes a guided unit 41 moving along the guide groove 31. The cover members 3A, 3B further include: a pressing unit 71 disposed upward an IC chip 81 of a housing unit 11 at a standby position, for depressing the top face of the IC chip 81 of the housing unit 11 at a stationary position to press the IC chip 81 to a terminal 12; and a locking craw 44 for latching a latch block inside part 32b of the main body 2 by the disposition at the stationary position, to limit the movement of the cover members 3A, 3B not to slide the direction of the standby position.