SUBSTRATE FOR SUSPENSION, SUSPENSION, SUSPENSION WITH ELEMENT, AND HARD DISK DRIVE

PROBLEM TO BE SOLVED: To provide a substrate for suspension with improved design flexibility of a wiring layer.SOLUTION: A substrate for suspension comprises: a metal support substrate; an insulator layer; and a wiring layer,which are laminated in this order. The wiring layer includes a terminal par...

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Hauptverfasser:	OCHI KAZUNORI, ONUKI MASAO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate for suspension with improved design flexibility of a wiring layer.SOLUTION: A substrate for suspension comprises: a metal support substrate; an insulator layer; and a wiring layer,which are laminated in this order. The wiring layer includes a terminal part connected to an element or an external circuit board. The terminal part has a via part-containing terminal part that contains a via part penetrating through the insulator layer and connected to the metal support substrate in planar view. The via part-containing terminal part is connected to another wiring layer through a first metal support part, a jumper part, a second metal support part, and a second via part.