METHOD FOR MANUFACTURING FIBER BOARD AND FIBER BOARD

PROBLEM TO BE SOLVED: To more simply and inexpensively manufacture a fiber board that has enhanced adhesiveness among filaments and thereby has superior basic performance such as strength, durability and dimension stability.SOLUTION: This method for manufacturing the fiber board comprises the steps...

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Bibliographische Detailangaben
Hauptverfasser: ONISHI KENJI, MORITA SEISHI, MATSUMURA KOICHI, ADACHI ARIHIRO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To more simply and inexpensively manufacture a fiber board that has enhanced adhesiveness among filaments and thereby has superior basic performance such as strength, durability and dimension stability.SOLUTION: This method for manufacturing the fiber board comprises the steps of:preparing a material to be bonded, which contains filaments 3 having an average fiber length of 5 mm or more and 50 mm or less and staples 4 having an average fiber length of 2 mm or more and less than 5 mm; supplying a liquid thermosetting resin 6 to the material to be bonded by spraying the liquid thermosetting resin 6 while agitating the material to be bonded; and then subjecting the resultant mixture to hot pressing treatment.